Feature |
Capability |
Production Capacity |
1,000,000 sq.ft/Month |
Layer(mass production) |
2 to 24 Layers |
Max Panel Size |
450*660mm |
Copper Clad Laminate |
FR4,FR4(Halogen free),FR5,CEM-1 ,CEM-3 ,
PTFE,Rogers,Getek,BT,Polyimide,
Al Base,High-TG(TG>170 ¡æ ) |
Base Copper Thickness |
1/3 OZ --6 OZ |
Impedance Control |
+/-8% |
Board Thickness |
Min:6mil(0.15mm)
Max:280mil(7mm) |
Minimum Thickness of CCL |
.5mil (0.0875mm) (Include Cu) |
Blind/Buried hole |
YES |
Drilling (Minimum size) |
Mechanical drilling Laser drilling |
8mil(0.2mm) 4mil(0.1mm) |
Inner Etching |
Minimum line/Space(A/W) Line Width Tolerance Board Thickness(min) |
2.5mil(0.0625mm) +/-8% 2.5mil(0.625mm) |
Plating Hole |
Minimum Hole Size Aspect Ratio (max) Position Accurary |
6mil (0.15mm)
12:1 +/-1.8mil(0.045mm) |
Microvia |
Minimum Hole Size Aspect Ratio (max) |
3mil(0.075mm) 1:1 |
Outer Etching |
Minimum Width /Space Line Width Tolerance |
2.5mil(0.05mm) +/-0.4mil(0.01mm) |
Solder Mask |
Bridge Position Accurary |
3.0mil(0.075mm) 1.5mil(0.0375mm) |
Selective Gold Plating |
Gold Thickness |
100u ¡å (2.5um) |
Press |
Thickness Tolerance Wrap/Twist Inner Opening (min) |
8% 0.5% (1) 4/L:5mil(0.125mm) (2) 6/L-8/L:6mil(0.15mm) (3) 8/L or above:8mil(0.2mm) |
Surface Treatment
|
Hot Air Leveling,Gold/Nickel Plating,Immersion Gold/Tin/Sliver,Gold Finger, Peeable mask,Carbon Ink,OSP(Entek,F2) |
Test |
AOI Test,Flying-needle Test,Fixture Test |
Lead Time |
sample mass production |
S/D L:3days;4-8L:5-15days S/D L:5days;4-8L:10-25days |
